Global Wafer-level Packaging Equipment Market Research Report 2017 to 2022presents an in-depth assessment of the Wafer-level Packaging Equipment including enabling technologies, key trends, market drivers, challenges, standardization, regulatory landscape, deployment models, operator case studies, opportunities, future roadmap, value chain, ecosystem player profiles and strategies. The report also presents forecasts for Wafer-level Packaging Equipment investments from 2017 till 2022.
This study answers several questions for stakeholders, primarily which market segments they should focus upon during the next five years to prioritize their efforts and investments. These stakeholders include Wafer-level Packaging Equipment manufacturers such as Applied Materials, Tokyo Electron, KLA-Tencor Corporation, EV Group, Tokyo Seimitsu, Disco, SEMES, Suss Microtec, Ultratech, Rudolph Technologies, etc.
Primary sources are mainly industry experts from core and related industries, and suppliers, manufacturers, distributors, service providers, and organizations related to all segments of the industry’s supply chain. The bottom-up approach was used to estimate the global market size of Wafer-level Packaging Equipment based on end-use industry and region, in terms of value. With the data triangulation procedure and validation of data through primary interviews, the exact values of the overall parent market, and individual market sizes were determined and confirmed in this study.