ENSINGER introduces TECASINT product line
ENSINGER, a supplier and processor of semi-finished products, profiles and technical parts made of engineering and high-performance plastics, has extended its program within the area of amorphous, non-melting high-temperature polyimides.
The new product line, TECASINT, includes several new developments and modifications, as well as proven materials which have been established in the market under the brand name SINTIMID. The company introduces semi-finished products and direct formed parts made of the new material TECASINT 2000 which is characterized, amongst other things, by improved toughness. The polyimide portfolio is to be further developed in 2009.
Semi-finished products and direct formed parts made of TECASINT have outstanding long-term thermal stability. The broad temperature range of these materials extends from -270 °C to 300 °C. TECASINT MATERIALS will even withstand short-term heating to 350 °C, without melting or softening. Material strength, dimensional stability and creep resistance under mechanical load also remain high in continuous use.
The sintering material, TECASINT 1000, was introduced 20 years ago to the market under the name SINTIMID. The newly developed products from ENSINGER include the high-temperature polyimides in the TECASINT 2000 series. These rigid and hard materials exhibit a high Young’s modulus and improved thermal stability and sliding friction characteristics compared to TECASINT 1000. A further advantage of the new development is the clearly reduced moisture absorption, which permits narrow construction tolerances to be achieved. In addition, the material can be machined with high precision thanks to its high degree of toughness.
TECASINT 2000 is eminently suitable for the direct forming procedure, which allows economical volume production of parts, for example, in automotive industry and mechanical engineering. ENSINGER offers the new product in different tribologically optimized variations for use in sliding friction applications.